Tomorrow's Joining Solutions Today
Dynajoin Corporation was founded to commercialize the use of Variable Melting Point soldering and brazing. Building off award winning research undertaken by Dr. Stephen Corbin's research team at the University of Waterloo, this technology has the potential to revolutionize industrial joining, with broad implications for the microelectronics, automotive and aerospace industries. The Company was founded through the generous support of the Ontario Centres of Excellence and the Martin Walmsley Fellowship.
Dynajoin Corporation intends to be the world's premier supplier of Variable Melting Point, lead-free joining solutions. Through our expertise in Smart Soldering we will develop lead-free solutions to meet the needs of the microelectronics industry. Dynajoin will also strive to develop novel solutions to challenging joining applications in a broad range of industries and market segments where a Variable Melting Point will benefit our customers. We intend to provide our customers with high-tech solutions to their joining challenges, with reliable, high quality, on-time delivery.
Dynajoin Corporation will grow to become a major supplier of joining solutions to meet the needs of a global market place. World-class research and development will be used to offer new and innovative solutions to our customers' joining needs. Dynajoin intends to deliver these solutions to satisfy the needs of our customers in the most effective and profitable way. A combination of in-house manufacturing and licensing agreements will be used to target a broad range of market segments. Dynajoin will also focus on continued research and development, to remain at the forefront of the joining industry.